Build liquid and air-cooling test setup and procedures
Thermal and mechanical testing of the test boards
Microchannel cold plate design, test and characterization Wind tunnel measurements to produce Impedance and flow rate data for Rivos enclosures
Compile test data and generate reportsTransient thermal modeling of Rivos packages for thermal/power management
Support mechanical design at the board and chassis levels
Run CFD/FEA simulations (Icepak, Ansys Mechanical) and board level reliability analysis (Sherlock) for thermomechanical integrity and lifetime predictions
Requirements:
B.S. degree in Mechanical Engineering, Physics, Applied Sciences, a 2nd year M.S. or Ph.D. student in similar disciplines.
Team player with good communication and interpersonal skills.
Passionate for working in a startup environment.
Enthusiastic about exploring, learning new techniques and applying them to simulations/analysis and design.
Experience with liquid cooling systems and testing.
Experience with airflow and wind tunnel measurements.
Experience with FEA and CFD simulations (Icepak, Ansys Mechanical and related Ansys suite of tools preferred).
Good knowledge/use of MS or Google Office Suite is a must.
Hands on with tools, lab equipment and comfortable working with various types of machinery.
Familiarity with carrying out various types of measurements and acquiring data on mockups and other lab hardware equipment (strain gauges, stress measurements, temperature measurements, metrology etc.)
Implementing test plans: setting up and conducting tests or experiments with attention to detail.
Ability to use and interpret data from DAQ systems, perform analyses and data reduction and communicate/present to the hardware team members outside the mechanical/thermal group.